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Home >> Rogers Corporation News >> Release 02/18/2010

Rogers Corporation News

Rogers Corporation to Exhibit Power Electronic Solutions at APEC 2010 with Products from Two of its Divisions
Release Date: 02/18/2010
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Chandler, AZ, February 18, 2010 – Two divisions of Rogers Corporation - Power Distribution Systems and Thermal Management Solutions – will be exhibiting at the upcoming Applied Power Electronics Conference (APEC) and Exposition (Booth # 235) in Palm Springs, CA, February 21-25.

Power Distribution Systems - RO-LINX

Rogers Power Distribution Systems will be exhibiting its RO-LINX® custom designed busbars.

Rogers will present its broad RO-LINX busbars product family including RO-LINX Performance, RO-LINX Easy and RO-LINX Thermal. RO-LINX busbars serve as power distribution highways. Rogers laminated busbars enable high current density and power switching with minimal losses through the power module. Benefits include: optimized inductance, compact design, reduction of installation time and the UL rating.

The Thermal Management Solutions Division from will be showcasing its HEATWAVE ™ high performance AISiC metal matrix composites (MMCs) that combine excellent thermal conductivity and controlled thermal expansion with low density and high stiffness to match the performance characteristics of today’s most advanced power semiconductor device packaging solutions and systems.

Thermal Management Solutions - HEATWAVE

Rogers HEATWAVE materials improve long-term reliability and thermal performance, and deliver ease of integration into semiconductor and high-power amplifier applications. With thermal conductivities from 170 to 230W/m/K, they provide the widest possible range of tailored coefficient of thermal expansion (CTE) performance.

For more information on Power Distribution Systems from Rogers, visit www.rogerscorp.com/pds. For Thermal Management Solutions, visit www.rogerscorp.com/tms.

About Rogers Corporation

Rogers Corporation, headquartered in Rogers, CT, is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut, Illinois and Virginia), Europe (Ghent, Belgium and Bremen, Germany) and Asia (Suzhou, China). In Asia, Rogers maintains sales offices in Japan, China, Taiwan, Korea and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation, in Taiwan with Chang Chun Plastics Co., Ltd. and in the U.S. with Mitsui Chemicals, Inc. The world runs better with Rogers.® www.rogerscorp.com.

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