Semiconductor

Advanced packaging products offer you all the features and benefits you need to optimize your component's performance while ensuring manufacturing ease and reliability. Our wide range, high frequency material has outstanding thermal and mechanical properties coupled with industry leading electrical performance.

Thin dielectric and flexible circuit materials are used in interconnecting devices and stand-alone devices. Flex circuits can be populated with electronic components like a PC board, with the benefit of flexible shapes and motion. Flex circuits offer superior electrical and mechanical performance, as compared to other interconnect devices such as ribbon cable and hard wire.

	RO2808™ Fluoropolymer Composite Circuit Laminates for Advanced Packaging Applications The combination of high dielectric constant and thin dielectric thickness of RO2808 products offers excellent electrical performance - high capacitance per unit area - which could significantly increase the density of the integrated components and reduce the package module footprint.

	RO4000® Series High Frequency Circuit Materials (Woven glass reinforced, ceramic filled thermoset) Enables lower cost manufacturing using standard PCB process. Features high thermal conductivity for reduced thermal stresses on the die. Controlled CTE enables greater reliability and reduces warpage.

	ULTRALAM® 3000 Series Liquid Crystalline Polymer Circuit Materials Achieve high yield on large panels sizes due to excellent dimensional stability Superior moisture resistance translates to high reliability packages Excellent electrical performance

	R/flex® 8080 Liquid Photoimageable Covercoat Enables ultra-fine patterns needed for today's high-density flexible printed circuits. Designed for manufacturing high precision patterns unattainable through conventional screen printing. Provides uniform coverage and reliable performance in mass production processes.